Product Description

F**0 Series
F **0 Solder Paste series is a state-of-the-art lead free no clean solder paste that promotes wetting and minimises soldering defects. The F **0 flux system is specifically optimised for Sn/Ag/Cu alloy soldering. Extensive testing at customer locations has proven this paste to be capable of defect-free performance in theproduction environment.The F **0 Series exhibits minimal slump and has excellent print-after-wait performance. This formula provides superior performance on a variety of surfaces finishes and leaves behind a clearresidue. Reflow can be accomplished in air or nitrogen.
 
Key Benefits
Exceptional print to print consistency.
Excellent wetting.
Min. 8 hour tack and work life.
Very good print after wait performance.
SIR *5/*5 > *0E*0 Ohm.
Constant performance at *0°C for 7days.
Work conditions between *0 and *2°C
Fulfils Siemens Standard accord. DIN EN ****4